The processes involved in Printed Circuit Board Fabrication Over the years
electronic devices have become smarter. Reduction in size and increased capacity
to do complex tasks effectively made electronics to be used in many places for
better functionality. One of the biggest inventions, which aided this process
enormously are Printed Circuit Boards. PCBs revolutionized the internal
mechanisms of a wide range of devices. It enabled the devices to get sleek and
slender. They gave a chance to fix multiple chips, resistors and circuits in a
limited space. PCBs are made up of insulating material like glass of reinforced
plastics and fiber glass etc. copper tracks are infused into PCBs ensure
electricity pathways. PCBs are actually flat boards some times in multiple
layers with a coated surface. This held the entire components firm. The most
complex thing about PCB is its fabrication PCB Prototype
Manufacturer.
Printed Circuit Board Fabrication involves quite
a few processes. The manufacturing begins when the design is ready. The
different processes include:
The designs are read into PCB CAMs. Without
PCB CAAAAM it is not possible to manufacture PCBs. The CAM are manages infusing
the data, the Gerber data prepared during the designing purpose. It also
verifies and compensates the deviations if any during the fabrication process.
Besides, CAMs are also used for panelizing and digital tool
output.
Panelization Process:
This process is used to make
tiny PCBs. Under this process multiple tiny Circuits are made at once. Similar
PCBs are printed on a large board. All these will be separated into individual
boards after manufacturing by depanelling Rigid flex PCB. Sometimes they
separate on their own some other times physically mechanically they are
separated.
Inner layers Etching Process:
The process of
infusing Copper tracks into the board is called Copper Pattern. Quite a few
methods are used to do this. This is generally done by removing the unnecessary
copper from a complete copper coated board. The methods include Silk Screen
Printing, Photoengraving and PCB milling etc. these can also done by Volume
method and chemical methods.
Automatic Optical Inspection (AOI) of
inner automated layers:
once laminated the changes can't be made to
inner circuits, it is imperative to put these to rigorous testing. So various
automated as well mechanical tests are done to ensure its proper functionality
before laminating/
Lamination Process:
Since most of the
PCBs are multi layered they have to be properly Laminated. In the lamination
process it is made sure that the components are placed properly and the traces
of them properly has to be so as to complete connections and
The other
processes include in the Printed Circuit Board Fabrication are plating,
Coating, Solder masking, component designators printing and assembly.
Related
Links