E Body Of Knowledge: Cpu Packaging Technology Xiang Jie
So-called "CPU
packaging technology" is a way to IC Insulating plastic or ceramic materials
packaged technology. To CPU, for example, we see the actual size and appearance
of the CPU core is not really the size and appearance, but the CPU core and
other components have been packaged products.
CPU package for
Chip Is necessary, is essential. Because the chip must be isolated with the
outside world to prevent the air of impurities on the chip circuit caused by
corrosion Electric Performance. On the other hand, packaged chips are easier to
install and transport. As packaging technology is good or bad is also a direct
impact on their performance chips to play and connected with PCB (Printed
circuit board) design and manufacturing, so it is essential. Package can also be
said that installation of Semiconductor Shell used in integrated circuit chip,
which not only plays placed, fixed, sealed, to protect and enhance the thermal
performance of chip effect, but also to communicate with the outside world
circuit chip bridge?? Chip contacts with a wire connected to the package shell
pins, these pins through the printed circuit board then wire and other devices
to connect. Thus, for many integrated circuit products, packaging technology is
a critical part.
CPU package currently used mostly for
insulation materials, plastic or ceramic packing up, can play a seal and improve
the performance of the role of chip heating. As the processor chips are now
increasing in frequency, more powerful, more and more pins, the package also
constantly changing shape. Packaging is a major consideration:
Chip area and packaging area to improve the packaging efficiency
ratio, as close to 1:1
Pin should be as short as possible to
reduce the delay, the distance between pins as well, to ensure no interference
and improve performance
Based on thermal requirements, the
thinner the better package
As an important part of the computer,
CPU's performance directly affects the computer's overall performance. The CPU
is also the last step of the manufacturing process the most critical step is to
CPU packaging technology, packaging technology, different CPU, there is a big
gap in performance. Only high-quality packaging technology to produce the
perfect CPU products.
CPU chip packaging technology:
DIP package
DIP package (DualIn-linePackage),
also known as dual in-line packaging, means the form of dual in-line package
integrated circuit chip, most small and medium-scale integrated circuits adopt
this package, the lead number of generally not more than 100 feet. DIP package,
the CPU chip has two rows of pins, you need to insert into the structure of the
chip with DIP Socket On. Of course, you can solder directly plugged into the
same number of holes and geometric arrangement of the circuit board welding. DIP
packaged chips from the chip outlet plug should be especially careful not to
damage the pin. DIP package structure are: multi-layer ceramic DIP DIP,
single-layer ceramic DIP DIP, lead frame DIP (including glass-ceramic sealing
type plastic encapsulation structure, low-melting glass ceramic package type)
and so on.
DIP package has the following characteristics:
1. Suitable for PCB (printed circuit board) on the hole welded,
easy to operate Prototype PCB.
2. Chip area and the ratio between the larger package size, so
size is also larger.
First 4004,8008,8086,8088, etc. are used
CPU DIP package, through its two rows of pins on the motherboard can be plugged
into the slot or soldered onto the motherboard.
QFP package
Chinese meaning of this technology is called a square flat-type
package technology (PlasticQuadFlatPockage), the technology of the CPU chip, the
distance between pins is very small, very small pins Rigid flex PCB, the general
large-scale or large scale integrated circuits using this package, the pins are
generally above 100.
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