Surface Mount Technology
Miniturization, reduction and resistance to damage
and reduced labor, a few of many benefits that prove surface mount technology
PCB assembly is far superior and cost efficient compared to through the hole
assembly in the production of electronic devices. Surface mount technology is
used in the production of printed circuit boards otherwise known as SMT PCB
assembly. Miniturization of current electronic products is beholden to surface
mount PCB assembly. Prior to surface mount devices, through the hole soldering
assembly was used, it didn't allow for the compact PCB's available today. To
compare, the 80's clunkly desktops in contrast to laptops, tablets and
smartphones today. Currently, the miniatureized computer devices surpass in
larger memory, increased power, speed, size and are much quieter.
The
newer complex technology, SMT assembly, involves attachment by soldering,
compactly mounting these devices onto the surface of a PCB. Comparatively Rigid flex PCB, the original soldering
process performed by humans and solder wire was not as efficient and more
costly. Simply put, the difference is in the mechanics of the soldering; SMT
assembly uses solder paste for attachment allowing for more compact devices,
whereas, through the hole uses solder wire, takes up more PCB real estate. SMT
assembly has not totally replaced through the hole assembly, sometimes the
processes are used simultaneously and occasionally the older process is solely
used in certain products.
Mass production of the SMT PCB's, built by
X-ray machines in a "clean room Rigid
flex," a sanitary controlled manufacturing process, results in devices that
are more reliable, contain no contaminants and are less prone to error in
soldering. This increased quality and reduction in price of PCB's. Built upon
compact PCB's, surface mounted components weigh less due to mass which improve
resistance to shock or vibration. Assembly by machines allows for cost
efficiency through reduced labor and greater productivity. In the era of "green
technologies" Surface Mount PCB Assembly is space saving; from manufacturing to
storage, ownership and eventual refuse.
SMT companies have varying
processes and kinds of SMT equipments used in manufacturing; companies practice
lead free techniques, while others still use solder wire in rework or repair.
Most important to stress, SMT is absolutely no different from through the hole
components in regards to function, SMT is smaller, and thus by design, bestows a
superior electrical performance.
Surface mount technology offers a
variety of benefits compared to the original pioneering through the hole
soldering assembly technique currently used in SMT PCB Assembly.
Miniaturization, reduction, resistance to damage, an increase in mass
production, reduced labor, these are just a few of the characteristics that
prove surface mount PCB assembly to be superior and cost efficient compared to
the older through the hole technology in the production of electronic
devices.
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