Research On Global And China Ic Substrate Industry
With the improvement of
IC operating frequency and integration, traditional leadframe packaging is out
of use, and IC has to be packaged by substrates. By packaging mode, the
mainstream IC substrates include BGA (Ball Grid Array), CSP (Chip Scale Package)
and FC (Flip Chip), of which the latter two now prevail.
http://www.ronpcb.com
In 2012, the global IC substrate market will value
USD8.67 billion. IC substrates mainly find application in PC, mobile phone and
base station, particularly PC is the biggest consumer. Inside PC, CPU, GPU and
Northbridge IC all employs FC-BGA packaging, featuring large packaging area,
many layers and high unit price. CPU and GPU of smartphones use FC-CSP
packaging, so does CPU of some feature phones. In addition to CPU and GPU, most
of the IC in mobile phone (such as Bluetooth / WiFi / FM, CMOS image sensor, USB
controller, GPS, Touch Screen Controllers, Audio Codec, MOSFET, DC / DC
converter) adopt WLCSP packaging. The mobile phone IC shipment is huge, but with
the small-sized substrates, the mobile phone IC substrate has a far smaller
market size than the PC IC substrate.
IC substrate vendors are
principally PCB manufacturers Rigid
flex PCB, yet the direct customers of IC substrate are the IC packaging
companies. IDMs or IC Foundries produce IC die at first; then, packaging
companies complete IC packaging; next, the products are delivered to IC design
companies or IDMs, and finally shipped to electronics manufacturers. In general,
packaging companies exerts greatest influence on substrate
suppliers.
Taiwan IC packaging and testing industry ranks first in the
world, with 56% market share, while Chinese Mainland packaging and testing
industry just shares 3% PCB Prototype
Manufacturer. The reason why Taiwan has the developed IC packaging and
testing industry lies in that Taiwan boasts the globally largest wafer
foundries. 60% of the 50 nm (or below 50 nm) IC business is undertaken by TSMC.
Nearly all IC in smart phones is fabricated by TSMC and UMC. Three out of the
global top four packaging and testing corporations are from Taiwan. In the
global IC substrate packaging market, Taiwanese players sweep more than 70%
share.
Japanese manufacturers occupy the market of CPU, GPU and
Northbridge IC substrate for PC. In 2012, NGK quitted, and its market share was
taken by Taiwan's Nanya PCB. Also, Japanese companies reign in the high-end
market, they develop the FC-BGA technology with Intel and their positions remain
quite stable. IBIDEN is building a base in the Philippines to lower prices.
IBIDEN and Shinko focus on ABF substrates, both of which take no interest in BT
substrates in the field of communications.
When it comes to the South
Korean manufactures, SEMCO involves in the widest range of business. On the one
hand, it obtains many orders from Qualcomm and Samsung Electronics. On the other
hand, SEMCO also receives a small portion of orders from Intel or AMD. SIMMTECH,
also a leading memory PCB maker, is mainly engaged in the memory substrate
packaging. Memory PCBs will apply substrate packaging widely, in particular all
of MCP memory PCBs may utilize substrate packaging in 2013.
Among
Taiwanese manufacturers, Nanya PCB takes Intel as its major client, while Kinsus
is a PCB supplier for Qualcomm and Broadcom, 90% shipment of which goes to BT
substrate.
For more information kindly visit :
Research on Global
and China IC Substrate Industry
http://www.ronpcb.com
Related
Links